1030 Thickness Gauge
본문
페이지 정보
1030 Thickness Gauge
The easy control and simple to maintain,
LASER sensor enables to measure and control the thickness automatically in various applications.
LASER sensor enables to measure and control the thickness automatically in various applications.
|
SPECIFICATIONS
| Description | |
|---|---|
| Application | Film/sheet extrusion with no metallic additive |
| Measuring range | 40-4000µm |
| Measuring width | max 4000mm |
| Measurement pitch | 1mm (0.5-10mm) |
| Collimator size | 0.5mm(CD) |
| Scanning speed | 150mm/sec (50~350mm/sec) |
| Operating temperature | Up to 45℃ |
| Repeatability | ±1.5µm or ±0.01% / ±5µm(Sheet) or ±0.1% |
PROGRAM SOFTWARE
MEKプログラムの特徴
• ユーザーフレンドリーな構成 - 直感的なインターフェース
• 利用可能な言語 - 英語、中国語、日本語
• ユーザーHMIと計測データ通信(選択仕様)
• ユーザーの要求に合わせてカスタマイズ可能
デフォルト画面
| Description | |
|---|---|
| Run Environment | Self-made software based on Labview |
| Data display | gsm (basis weight) / um (thickness) Spatial resolution : 1mm |
| Data compatibility | Microsoft Excel, CSV |
| Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Staitstical-Process-Control) Trend chart FFT (Fast-Fourier-Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
| Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC(Automatic Profile Control)
MEKプログラムの特徴
- • 最適化された厚さ制御アルゴリズム
- • 迅速な厚さ制御
- • 自動マッピング: センターボルト基準
- • 滑らかなミルロールの外観
- • 数マイクロメートル以内の制御ゲイン自動調整
- • ダイボルト温度フィードバック制御（オプション仕様）
- • MD（マシン方向）制御可能（オプション仕様）
APC適用後のプロファイル変化
Before
APC control begins after the target thickness is changed to 60㎛ to 30㎛
After 5min
Regulates Control Gain of auto-die, reducing variation in thickness
After 10min
Steadily analyzes and controls the thickness profiles
After 15min
Within 15min, produces the best result
