1050 Thickness Gauge
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SPECIFICATIONS
Description | |
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Application | secondary battery electrode plates,Sheet, plate extrusion |
Range | 0.03mm~3.6mm/0.3~30mm |
Width | max. 1,000mm(C-Frame), 2,000mm(O-frame) |
Pitch | 1mm (0.5-10mm) |
Spot size | 70µm/300µm |
Scanning Speed | 150mm/sec (50~350mm/sec) |
Operating temperature | Up to 45℃(60℃) |
Repeatability | - Reproducibility during base fabric shutdown±0.02µm(10Scan) - Reproducibility during electrode fabric movement±0.2µm (May vary depending on product quality) - Base fabric reproducibility during movement±0.1µm - Sensor resolution ±0.0025µm/0.25µm |
PROGRAM SOFTWARE
MEKプログラムの特徴
- • ユーザーフレンドリーな構成 - 直感的なインターフェース
- • 利用可能な言語 - 英語、中国語、日本語
- • ユーザーHMIと計測データ通信(選択仕様)
- • ユーザーの要求に合わせてカスタマイズ可能
デフォルト画面
Description | |
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Run Environment | Self-made software based on Labview |
Data display | gsm (basis weight) / um (thickness) Spatial resolution : 1mm |
Data compatibility | Microsoft Excel, CSV |
Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Staitstical-Process-Control) Trend chart FFT (Fast-Fourier-Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC(Automatic Profile Control)
MEKプログラムの特徴
- • 最適化された厚さ制御アルゴリズム
- • 迅速な厚さ制御
- • 自動マッピング: センターボルト基準
- • 滑らかなミルロールの外観
- • 数マイクロメートル以内の制御ゲイン自動調整
- • ダイボルト温度フィードバック制御(オプション仕様)
- • MD(マシン方向)制御可能(オプション仕様)
APC適用後のプロファイル変化
Before
APC control begins after the target thickness is changed to 60㎛ to 30㎛
After 5min
Regulates Control Gain of auto-die, reducing variation in thickness
After 10min
Steadily analyzes and controls the thickness profiles
After 15min
Within 15min, produces the best result