6800X Thickness Gauge
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SPECIFICATIONS
Description | |
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Application | Film/sheet extrusion, coating, metals, paper, etc. |
Measuring range | 0-350gsm, 0-4,000gsm |
Measuring width | 2,500mm |
Measurement pitch | 1mm (0.5-10mm) |
Collimator size | ф7 |
Scanning speed | 150mm/sec (50~350mm/sec) |
Measuring gap | 10mm (8~38mm) |
Operating temperature | Up to 45℃ |
Repeatability | ±0.015µm or ±0.01%(PET), ±0.0002µm (Cu) |
Streak analysis | 0.05mm |
PROGRAM SOFTWARE
Features of the MEK Program
- • User-friendly Configuration - Intuitive Interface
- • Language Options - English, Chinese, Japanese
- • User HMI and Measurement Data Communication (Optional)
- • Customization to Suit User Requirements
Default Screen
Description | |
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Run Environment | LabVIEW-based proprietary software |
Data display | gsm (basis weight) / um (thickness) Spatial resolution: 1mm |
Data compatibility | Microsoft Excel, CSV |
Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Statistical Process Control) Trend chart FFT (Fast Fourier Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC (Automatic Profile Control)
Features of the MEK Program
- • Optimized thickness control algorithm
- • Fast thickness control
- • Auto Mapping: Center bolt reference
- • Smooth Mill Roll appearance
- • Automatic adjustment of Control Gain within a few microns
- • Die bolt temperature feedback control (optional)
- • MD (Machine Direction) control available (optional)
Profile Changes After Applying APC
Before
APC control begins after the target thickness is changed from 60㎛ to 30㎛
After 5 minutes
Regulates Control Gain of the auto-die, reducing variation in thickness
After 10 minutes
Steadily analyzes and controls the thickness profiles
After 15 minutes
Within 15 minutes, produces the best result